Phillip Chen

Credentials:
Intel Engineer 1999 - Present
Previously an engineer, project manager in Intermedics (Guidant Corp.)
and Microsystems Engineering Inc.
Inventor of 7 US patents; Author of many publications
M.S., Material Science, State University of New York at Stony Brook
B.S., Chemistry and Engineering, State University of New York at Stony
Brook
Member of IMAPS (International Microelectronics and Packaging Society)
and SMTA (Surface Mount Technology Association)

Philip Chen is currently a hardware engineer with Intel working on system platform technology for Desktop Product Group (DPG). Philip Chen has more than 15 years experience in the microelectronics industry including thin and thick film technology, semiconductor backend process and packaging technology, semiconductor packaging material development, implantable medical device packaging technology and surface mount assembly technology. Philip Chen holds 7 US patents and number of technical publications. Philip Chen earned both MS degree in Material Science and BS degree in Chemistry and Engineering from State University
of New York at Stony Brook. He is also associated with IMAPS (International Microelectronics and Packaging Society) and SMTA (Surface Mount Technology Association).

Editor's Note: Philip has demonstrated a strong leadership and administration capacity in CASPA-Portland. He has diverse talents. He loves classic Chinese painting and calligraphy. He is also a gourmet chef. We were lucky to enjoy his wonderful cooking during BOD meetings. He enjoys tennis, hiking and snow ski. His wife, Cyndy, is also a beautiful professional in hi-tech industry. They have two teen age daughters (what a parenting challenges). CASPA-Portland is grateful for Philip and Cyndy's dedication.